Presentation
| Product range | RL-044 V2.0 |
| Product type | BGA Screen |
Sale package
| Pack | Bulk |
| Content | BGA Stencils |
| Product status | New |
BGA Stencil Relife RL-044 V2.0
for Samsung Series CPU
BGA Stencil Relife RL-044 V2.0 for Samsung Series CPU is a professional set designed for rebaling operations and solder ball placement
on processors used in Samsung phones. It is a suitable choice for GSM repair shops and technicians performing advanced repairs
at the motherboard level. The set includes 15 integrated stencils, made for precise and uniform work in the process of restoring soldering points.
Thanks to the well-made construction, they allow correct positioning of the solder and contribute to achieving clean and stable results during interventions
on CPU components. The RL-044 V2.0 model is specially designed for the Samsung series, offering good compatibility with the processors used
in these devices. The stencil is suitable for professional service work, where precision and stability in the rebaling process are essential.
Thanks to the set format, the technician has at hand several necessary options for various operations,
making the work process more efficient and better organized.
Features:
- Compatibility: Samsung Series CPU
- Product type: BGA stencil set for solder ball placement
- Usage: rebaling and restoring soldering points
- Set contents: 15 pieces
- Suitable for: professional motherboard-level repairs